TopLine 2012

find it fast series w td fc wlp-csp wlp-csp wlp-csp bga bga bga cbga clga bga bga ewlp m-qfn qfn ball devices webcode description view page 33 156-157 34-35 36 37-38 39-41 42-43 44-45 46-47 48-49 50 51 52 53 54-56 151-155 siliconwafers&die testsidieforpractice flip chip 0.3mmpitchflip chip 0.4mmpitch 0.5mmpitch 0.65mm,0.75mm,0.8mmpitch 1.0mmpitch 1.27mmpitch bga ceramic1.27mmpitch ceramic land grid array 1.5mmpitch ballcountchart embeddedcspcupost qfn quad flat lead opencavityqfn xe1 xe1 xi1 xj1 xu1 xh1 throughhole devices series dip to terminal cf&do description dualinlinepackage transistor solder terminals resistors&diodes view webcode page 57 58 59 60 xn1 xt1 xr1 xa1 do cf series description trays 4 view webcode page 61 62-64 wafflepackforbaredie2 and4 jedecmatrixcomponenttrays xz1 xz1