TopLine 2012

wlp csp wafer level product 0.3mm pitch oh s pb-f ee r r dummy component ordering information fig 1 2 3 4 5 6 7 8 nbr balls 100 144 196 256 264 400 676 900 body size 3.0mm 3.6mm 4.2mm 4.8mm 6.0mm 6.0mm 7.8mm 9.0mm ball allignment full ful full full 6-row full full full ball matrix 10x10 12x12 14x14 16x16 17x17 26x26 26x26 30x30 4 waffle part number substrate si si si si si si si si xj1 qty 256 256 196 144 121 121 64 49 wlp100t.3c-dc108d wlp144t.3c-dc127d wlp196t.3c-dc148d wlp256t.3c-dc168d wlp264t.3c-dc173d wlp400t.3c-dc208d wlp676t.3c-dc260d wlp900t.3c-dc307d fig.1 kjhgfedcba 10 9 8 7 6 5 4 3 2 1 fig.2 mlkjhgfedcba 12 11 10 9 8 7 6 5 4 3 2 1 fig.3 pnmlkjhgfedcba 14 13 12 11 10 9 8 7 6 5 4 3 2 1 fig.4 trpnmlkjhgfedcba 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 wlp100t.3c-dc108d fig.5 utrpnmlkjhgfedcba 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 wlp144t.3c-dc127d fig.6 ywvutrpnmlkjhgfedcba 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 wlp196t.3c-dc148d fig.7 af ae ad ac ab aa ywvutrpnm